1、embossing bonding
2、diffusion bonding
3、film carrier bonding
4、hydrogen bonding energy
5、intermolecular hydrogen bonding
6、Avoid negative bonding.
7、This is ionic bonding.
8、Research of locating bonding points automatically in chip bonding
9、bonding of propeller to shaft
10、Anti-bonding is even higher in energy than non-bonding.
11、It promotes bonding between individuals.
12、The body produces Oxytocin, the bonding hormone.
13、Gold wire for semiconductor devices lead bonding
14、And there's weak hydrogen bonding between them.
15、So it's an Anti-bonding orbital.
16、Design and Research of Ultrasonic Wire-bonding System for Al Wire-bonding Machine;
17、The effect of 2 bonding material on the vertically fractured roots of Bonding Therapy & Intentional Replantation
18、Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding.
19、So if we name this orbital, this is an anti-bonding molecular orbital So we had bonding and now we're talking about anti-bonding.
20、The effect of bonding time on the bonding strength of thick aluminum wire wedge bonding was studied under different ultrasonic power conditions.
21、Preparation and bonding performance of epoxy resin modified by polyurethane
22、That's what we see are involved in bonding.
23、Therefore, TLP bonding can be widely applied in oil industry.
24、The bonding plan which made by process engineers according to pads with different sizes greatly influences the wire bonding quality.
25、Study on MTC enhancing the second interface bonding strength
26、And so this lower level is called a bonding orbital, and it is a bonding molecular orbital.
27、The effects of catalysts on the bonding processing property and bonding strength of polyurethane adhesive were studied in this article.
28、Friendship appears to be a unique form of human bonding.
29、Measure, cut and install carpeting using hand or machine stitcher, seaming iron, bonding tape or other bonding materials.
30、The direct bonding joint between cemented carbide and nodular cast iron and the indirect bonding joint by using nickel foil as intermediate layer were obtained by HIP diffusion bonding process.
