1、Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
2、Traditionally, any exposed copper was plated with solder by hot air solder levelling (HASL).
3、The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
4、The study included three aspects, which are the resistance force appearing in the solder paste printing, the solder ball test and solder paste wetting test.
5、Equipment specifically designed for use with solder paste.
6、The process is directly between the two types of metal welding, a solid solder joint appearance, there is no brittle fracture caused by tin solder, oxidation, solder false.
7、Effect of particle size distribution and oxygen content of solder powder on the stability of solder paste were investigated.
8、An ideal connection that puts any solder to shame.
9、In the test the solder ability plating coating.
10、a hot flame will make the solder run.
11、Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
12、And the different section shape of the solder joint is given with the variation of solder volume.
13、The second technique involved using braided solder wick and a soldering iron with a blade tip to remove residual solder from the PCB pad.
14、Just remove the black wire and the solder that attaches it to the diodes and the same solder that connects the two diode together.
15、The text on the two solder mask layer is same, we will cancel the text that on this solder mask layer, please refer to Q9.
16、When the solder flows, remove the iron and let the area cool.
17、Some pastes do well with tinned surfaces but solder poorly bare copper OSP.
18、When joint is filled, a continuous run of solder or brazing alloy will be visible.
19、The extremely thin oxide coat will also hinder the solder wetting effect on metal surfaces.
20、The results are of importance to design and optimize of geometry shape of the solder joint.
21、Apart from pre-treatment products: powder paint, stripped from agents and removing wax water, antirust oil; Electronics and solder flux.
22、The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
23、In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.
24、In the microelectronic packaging, the reliability of the solder joint has been being a forward position and a hot topic.
25、The head of electric iron is heated to the melting point of welding solder, which is immersed with an even layer of solder and clean the head with clean, wet sponge or wet cloth.
26、Heat up your soldering iron and tin it by allowing it to melt a drop of solder onto its tip.
27、When all the gold does not dissolve in the solder brittle failure occurs near the goldsolder interface .
28、Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.
29、Utilizing this kind of solder, we have assembled laser arrays with single-bar pulse power of 100W and stacks with pulse power of 600W each.
30、Now press the hot iron firmly against the splice while letting the free end of your solder rest against the other side of the joint.