1、shockley barrier layer
2、The barrier layer is positioned on the substrate.
3、A laminated packaging material is composed of a thermoplastic material outermost layer, a paper base material layer, a conductive barrier layer and a heat sealing innermost layer.
4、The effect of back-barrier layer on the carrier distribution in the AlGaN/GaN double-heterostructure
5、Organic light-emitting-diodes by inserting C_(60) as exciton barrier layer
6、Good soldering result may be obtained by applying electroless nickel as barrier layer and electroless gold as top layer to provide solderability.
7、The alloy coating obtained is used as the barrier layer of wrought rolled copper foil in PCB manufacturing.
8、It is shown that overlaying oxygen barrier layer, appending active diluent monomer and prolonging exposure time are in favor of the photopolymerization of the product.
9、In AC electrical field, the stable homogeneous glow discharge will appear by using dielectric barrier layer and high-frequency power source.
10、Therefore, the barrier layer can prevent grinding fluid from infiltrating to the substrate during the polishing process, and further improve the effect and the quality of polishing and grinding.
