1、Research progress of diamond/metal composites for electronic packaging
2、So it is necessary to research and develope the advanced microelectronic packaging to replace the conventional electronic packaging.
3、In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with13 refs.
4、He has extensive experience in the fields of semiconductor and electronic packaging, electronic manufacturing, surface finishes and coatings, failure mode analysis and reliability assessment. Dr.
5、ANSYS Q3D Extractor software is the premier 3-d and 2-d parasitic extraction tool for engineers designing electronic packaging and power electronic equipment.
6、The invention relates to polyphenyl methylsiloxane modified epoxy resin and a manufacturing method of an electronic packaging material thereof.
7、The present paper is to cover the actuality of electronic packaging technology in the world and face the lead-free problem in homeland.
8、The resin had better process properties, higher mechanical properties, and could be used as a RTM matrix resin for high performance composites or as a high performance electronic packaging resin.
